- Ansys Mechanical
-Composites (ACP) -General -Scripting and Automation -Boundary Conditions -NVH -Linear and Nonlinear Dynamics -Fatigue -Nonlinear Adaptivity -Contact, Joint, Connections -Element Technology -Fracture -Large Model & MAPDL Interfaces -Materials -HPC -Structural Optimization -AQWA -Add-ons
-
Ansys LS-DYNA -Explicit Dynamics
-
Ansys Motion -Multibody Dynamics
- Ansys Discovery
-SpaceClaim to Discovery Migration -Performance Improvements -Fault-tolerant GPU Meshing -Explore mode -Refine mode -Bolt Monitors & Connection Assessment -Reaction Resultants -Structural Solver Enhancements -Discovery Burst to Cloud - Topology Optimization Support
- Ansys Granta
-One MI Explore UI/UX 개선 -데이터 내보내기 관련 STK 예제 추가 -RS(제한물질) & Sustainability(지속 가능성) 데이터 사용 -MaterialUniverse -High Temperature Alloys
- Ansys Additive
-DED Simulation (WA) -Sintering Simulation (WA) -PyAdditive -Additive Interface for Materialise Magics
-More Feature(+)
- Ansys Fluent
-GPU Solver -Fluent Web UI -Aerospace Advancements -Battery -Fluent Meshing
-More Feature(+)
- Ansys Q3D Extractor
-Feedback Iterator for electrothermal workflow -CG solution을 위한 새로운 Interpolating sweep
- Ansys SIwave
-Enhancements to SIwave Layout Assemblies -CPA : Performance Improvements
- Ansys Circuit
-Full MIPI C-Phy channel support [Beta] -Improved TDR waveform
- Ansys EMC Plus
-Mharness Interaction Point Library -EMI Receiver
- Ansys Charge Plus
-Minimum Shielding 과 TID 계산을 위한 Ray Tracing -Plasma Conductivity
-More Feature(+)
▶Systems&Optics (click)
-
Ansys Digital Twin -Accurate & Evolving Digital Twin with Twin Builder Hybrid Analytics -Hybrid Analytics and Scaled Deployment -Solver and Model Library -Reduced Order Model
-
Ansys Zemax -실제 카메라의 제조를 위한 설계 -NSC 결상 모델링 -생산성 향상 -Ansys Optics (연성 해석)
|
|
|
|